A chiplet is a discrete unpackaged die that can be assembled into a package with other chiplets; each chiplet is optimized to its function, using the node best suited to the function. The chiplet concept is often referred to as the disaggregation of the
system on chip (SoC), using
heterogeneous integration techniques to put multiple die or chiplets into a
system in package (SiP) or other
advanced packaging concept. The technology is still nascent and presents many issues for design, test, manufacturing, and integration teams to work out.
